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  1. FlipChips Dot Com free micropackaging information

    A free, neutral source providing micropackaging tutorials,articles, abstracts, technology updates, photographs, newsletter, supplier directory
    CSP1
    MEMS1
    microelectronics1
    optoelectronics1
    flip chip1
    flipchip1
    conductive adhesives1
    underfill1
    chip scale package1
    wafer bumping1
    conductive adhesive1
    nano-optics1
    solder bumping1
    ball bumping1
    underfills1
    die bumping1
    die flipping1
    single chip flipchip1
    stud bumping1
    wafer-level packaging1
    bumped die1
    flipchips1
    flip chips1
    bumped wafers0
    chipscale package0
    flip chip abstracts0
    flip chip articles0
    flipchip articles0
    flip chip information0
    flipchip information0
    flip chip literature0

    www.flipchips.com - 2009-02-04

  2. NEXX Systems: A semiconductor process equipment company focused on flip chip and advanced wafer level packaging technology.

    NEXX Systems develops and manufactures the Nimbus, Stratus, and Cirrus systems. ? Nimbus is a high throughput, low cost-of-ownership sputter deposition system ...
    semiconductor2
    MEMS1
    electroplating1
    etch1
    PVD1
    Cirrus1
    Stratus1
    CVD1
    Nimbus1
    flip chip1
    flipchip1
    UBM1
    flip-chip1
    electrodeposition1
    integrated passives1
    sputter deposition1
    wafer-level packaging1
    backside metallization1
    thin wafer processing1
    flip chip advanced packaging0
    redistribution layers0
    under bump metallization0

    www.nexxsystems.com - 2009-02-06

  3. Technia Business Solutions Limited - Home

    Technia Business Solutions Ltd is a provider of Business Development, Marketing and Project Management services to SMEs in the waste/recycling, renewables, ...
    design7
    planning4
    outsourcing3
    project management3
    recycling3
    waste2
    market research2
    grants2
    assisted living2
    semiconductor2
    interim management2
    medical devices2
    strategic marketing2
    public sector2
    new product development1
    MEMS1
    NPD1
    private sector1
    local authorities1
    strategy development1
    optoelectronics1
    gasification1
    anaerobic digestion1
    stakeholder engagement1
    energy from waste1
    EfW1
    compound semiconductor1
    welsh assembly government1
    cost-down1
    wafer-level packaging1
    manufacturing cost savings0

    www.tbsl.eu - 2009-02-10

flip chip1 nano2 mems1 csp1 micro2 flipchip1 bga1 bonding2 flip-chip1 nanotechnology2 pcb2

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